| 12341074 |
Semiconductor package with increased thermal dissipation |
Myungkee Chung, Aenee Jang |
2025-06-24 |
| 12237290 |
Semiconductor packages and methods of manufacturing the semiconductor packages |
Aenee Jang |
2025-02-25 |
| 12166013 |
Semiconductor package, and a package on package type semiconductor package having the same |
Hyunsoo Chung, Myungkee Chung |
2024-12-10 |
| 12033973 |
Semiconductor package |
Soohyun Nam |
2024-07-09 |
| 11817443 |
Semiconductor package including a first semiconductor chip with a plurality of first chip pads directly bonded to a plurality of second chip pads of an upper semiconductor chip |
— |
2023-11-14 |
| 11676875 |
Semiconductor package including non-conductive film between package substrate and semiconductor chip thereon |
Taewon Yoo |
2023-06-13 |
| 11581234 |
Semiconductor package with improved heat dissipation |
Myungkee Chung, Aenee Jang |
2023-02-14 |
| 11488937 |
Semiconductor package with stack structure and method of manufacturing the semiconductor package |
Hyunsoo Chung, Myungkee Chung |
2022-11-01 |
| 11222882 |
Semiconductor package including dummy chip on a first semiconductor chip and laterally spaced apart from a second semiconductor chip |
— |
2022-01-11 |
| 11164805 |
Semiconductor package including non-conductive film between package substrate and semiconductor chip thereon |
Taewon Yoo |
2021-11-02 |
| 8922007 |
Semiconductor package |
Jaegwon Jang |
2014-12-30 |
