Issued Patents All Time
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12092874 | Silicon photonic package and method of fabricating the same | — | 2024-09-17 |
| 11341678 | Device and method for calculating a vehicle trailer pose using a camera | — | 2022-05-24 |
| 11231386 | Compact microelectronic integrated gas sensor | Jerome Teysseyre, Suman Cherian | 2022-01-25 |
| 11105638 | Method, apparatus, and computer readable storage medium for updating electronic map | Xianpeng Lang, Changjie Ma | 2021-08-31 |
| 10909724 | Method, apparatus, and computer readable medium for adjusting color annotation of an image | Xiong Duan, Xianpeng Lang, Wang-Long Zhou, Miao Yan, Yifei Zhan +1 more | 2021-02-02 |
| 10885352 | Method, apparatus, and device for determining lane line on road | Xiong Duan, Wang-Long Zhou, Miao Yan, Yifei Zhan, Changjie Ma +1 more | 2021-01-05 |
| 10878621 | Method and apparatus for creating map and positioning moving entity | Wang-Long Zhou, Miao Yan, Yifei Zhan, Xiong Duan, Changjie Ma +1 more | 2020-12-29 |
| 10846543 | Method and apparatus for detecting lane line, and medium | Xiong Duan, Xianpeng Lang, Wang-Long Zhou, Miao Yan, Yifei Zhan +1 more | 2020-11-24 |
| 10789771 | Method and apparatus for fusing point cloud data | Wang-Long Zhou, Miao Yan, Yifei Zhan, Xiong Duan, Changjie Ma +1 more | 2020-09-29 |
| 10381504 | Wafer level packaging, optical detection sensor and method of forming same | Wee Chin Judy Lim | 2019-08-13 |
| 10128207 | Semiconductor packages with pillar and bump structures | Yun Liu, Jerome Teysseyre | 2018-11-13 |
| 10115842 | Semiconductor optical package and method | David Lawson, Colin Campbell, Anandan Ramasamy | 2018-10-30 |
| 9991409 | Wafer level packaging, optical detection sensor and method of forming same | Wee Chin Judy Lim | 2018-06-05 |
| 9851328 | Compact microelectronic integrated gas sensor | Jerome Teysseyre, Suman Cherian | 2017-12-26 |
| 9831357 | Semiconductor optical package and method | David Lawson, Colin Campbell, Anandan Ramasamy | 2017-11-28 |
| 9780080 | Method for making an optical proximity sensor by attaching an optical element to a package top plate and forming a package body to define an optical transmit cavity and an optical receive cavity | — | 2017-10-03 |
| 9455241 | Integrated circuit package and method of forming the same | Kiyoshi Kuwabara, Xavier Baraton | 2016-09-27 |
| 9448216 | Gas sensor device with frame passageways and related methods | Ravi Shankar | 2016-09-20 |
| 9252030 | System-in-packages and methods for forming same | — | 2016-02-02 |
| 9059058 | Image sensor device with IR filter and related methods | Jerome Teysseyre | 2015-06-16 |
| 9018645 | Optoelectronics assembly and method of making optoelectronics assembly | — | 2015-04-28 |
| 9013037 | Semiconductor package with improved pillar bump process and structure | — | 2015-04-21 |
| 9012269 | Reducing warpage for fan-out wafer level packaging | Xavier Baraton, Faxing Che | 2015-04-21 |
| 9013017 | Method for making image sensors using wafer-level processing and associated devices | Laurent Herard, WeeChinJudy Lim | 2015-04-21 |
| 8937008 | Apparatus and method for placing solder balls | — | 2015-01-20 |