Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9159656 | Semiconductor die package and method for making the same | Oseob Jeon, Boon Huan Gooi, Maria Cristina Estacio, David Chong, Tan Teik Keng +6 more | 2015-10-13 |
| 8664752 | Semiconductor die package and method for making the same | Oseob Jeon, Boon Huan Gooi, Maria Cristina Estacio, David Chong, Tan Teik Keng +6 more | 2014-03-04 |
| 8183088 | Semiconductor die package and method for making the same | Oseob Jeon, Boon Huan Gooi, Maria Cristina Estacio, Rajeev Joshi, Chung-Lin Wu +2 more | 2012-05-22 |