| 12209596 |
Configurable bi-directional airflow fan |
Peter Christopher McLean, Vic Hong Chia, Zahid Naveed Aziz, Harvey Yang |
2025-01-28 |
| 12207435 |
Cooling fan assembly with air guider |
Vic Hong Chia, Yaotsan Tsai, Hua Yang, Xin Mao |
2025-01-21 |
| 12167567 |
Fan silencer module |
Vic Hong Chia, Yaotsan Tsai, Hua Yang, Xin Mao |
2024-12-10 |
| 12156324 |
Thermal Interface Material (TIM) filling structure for high warpage chips |
Yaotsan Tsai, Vic Hong Chia, Hua Yang |
2024-11-26 |
| 11778725 |
Thermal interface material (TIM) filling structure for high warpage chips |
Yaotsan Tsai, Vic Hong Chia, Hua Yang |
2023-10-03 |
| 11758689 |
Vapor chamber embedded remote heatsink |
Yaotsan Tsai, Hua Yang, Vic Hong Chia |
2023-09-12 |
| 11465248 |
System and method for removing components of a fluid cooling system during operation |
Yaotsan Tsai, Zefeng Zhang, Hua Yang, Vic Hong Chia |
2022-10-11 |
| 9431317 |
Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit package |
Hujiao Wang, David A. Holtzclaw, Wei Qi, Benjamin L. Davis, John MacKay |
2016-08-30 |