Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9431317 | Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit package | Yongguo Chen, Hujiao Wang, David A. Holtzclaw, Wei Qi, Benjamin L. Davis | 2016-08-30 | $43,940,000 |