YC

Yiu Ming Cheung

AA Asm Assembly Automation: 14 patents #2 of 182Top 2%
AP Asm Technology Singapore Pte: 4 patents #34 of 338Top 15%
HU Hong Kong Baptist University: 2 patents #46 of 237Top 20%
AP Asmpt Singapore Pte.: 1 patents #14 of 77Top 20%
HU Hong Kong Polytechnic University: 1 patents #243 of 733Top 35%
IBM: 1 patents #44,794 of 70,183Top 65%
📍 Kowloon, CN: #2 of 13 inventorsTop 20%
Overall (All Time): #193,492 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Showing 1–22 of 22 patents

Patent #TitleCo-InventorsDate
11764098 Detaching a die from an adhesive tape by air ejection Ngai Tat Man, Jun Qi, Chi-yung Lee 2023-09-19
10186549 Gang bonding process for assembling a matrix of light-emitting elements Ming-Yang Li, Zetao MA, Kai Ming Yeung 2019-01-22
10014272 Die bonding with liquid phase solder Dewen Tian, Ming-Yang Li 2018-07-03
9583366 Thermally-enhanced provision of underfill to electronic devices using a stencil Qinglong Zhang, John Hon-Shing Lau, Ming-Yang Li, Michael Zahn 2017-02-28
9563805 Method and apparatus for eye gaze tracking Qinmu Peng 2017-02-07
9159321 Lip-password based speaker verification system Xin Liu 2015-10-13
8967452 Thermal compression bonding of semiconductor chips Tsan Yin Peter Lo, Ming-Yang Li, Yick Hong Mak, Ka San Lam 2015-03-03
8026126 Apparatus and method for thin die detachment Chi Ming Chong, Tat Wing LEE, Ka-Lok Leung 2011-09-27
7830597 Optical system having selectable field for inspection Siu Wing LAU, Zhuan Yun Zhang, Chi Ping Hung 2010-11-09
7757742 Vibration-induced die detachment system Man Kit Chow 2010-07-20
7665204 Die detachment apparatus comprising pre-peeling structure Shiqiang Yao, Gary Peter Widdowson 2010-02-23
7470120 Configurable die detachment apparatus 2008-12-30
7303647 Driving mechanism for chip detachment apparatus Shiqiang Yao, Gary Peter Widdowson 2007-12-04
7240422 Apparatus for semiconductor chip detachment Chou Kee Peter Liu, Ching Hong Yiu, Chi Ming Chong 2007-07-10
7182118 Pick and place assembly for transporting a film of material Chi Ming Chong 2007-02-27
6949146 Ultrasonic cleaning module for singulated electronic packages Chak Tong SZE 2005-09-27
6886997 Apparatus and method for active alignment of optical components Chou Kee Peter Liu, Ching Hong Yiu 2005-05-03
6746022 Chuck for holding a workpiece Ka W. Wong 2004-06-08
6711873 Apparatus for loading electronic packages of varying sizes Hoi Fung Tsang, Yui Ko Wong 2004-03-30
6655045 Apparatus and method for pick and place handling Pei Wei Tsai, Yu Sze Cheung 2003-12-02
6279810 Piezoelectric sensor for measuring bonding parameters Lai Wa Helen Chan-Wong, Siu Chiu, Siu Wing Or 2001-08-28
5535217 Method and apparatus for probabilistic clock synchronization with interval arithmetic Kenneth Ka Wah Ng, Hovey R. Strong, Jr. 1996-07-09