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Optoelectronic circuit having one or more double-sided substrates |
Nagesh R. Basavanhally |
2020-11-10 |
| 10359565 |
Optoelectronic circuit having one or more double-sided substrates |
Nagesh R. Basavanhally |
2019-07-23 |
| 10338329 |
Arrangement for connecting photonic and electronic components |
Nagesh R. Basavanhally |
2019-07-02 |
| 7217922 |
Planar micro-miniature ion trap devices |
Matthew Douglas Apau Jachowski, Stanley Pau |
2007-05-15 |
| 6603182 |
Packaging micromechanical devices |
David A. Ramsey |
2003-08-05 |
| 6370766 |
Manufacture of printed circuit cards |
Yinon Degani, Thomas Dixon Dudderar, Dean Paul Kossives |
2002-04-16 |
| 6313719 |
Method of tuning a planar filter with additional coupling created by bent resonator elements |
Ron Barnett, Zhengxiang Ma, King Leung Tai, Hui Wu |
2001-11-06 |
| 6297551 |
Integrated circuit packages with improved EMI characteristics |
Thomas Dixon Dudderar, Dean Paul Kossives |
2001-10-02 |
| 6232047 |
Fabricating high-Q RF components |
Robert C. Frye, King Lien Tai |
2001-05-15 |
| 6154370 |
Recessed flip-chip package |
Yinon Degani, Robert C. Frye |
2000-11-28 |
| 5898223 |
Chip-on-chip IC packages |
Robert C. Frye, Kevin O'Connor |
1999-04-27 |