Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9034654 | Method for analyzing the liquefied petroleum gas and device thereof | Hsiu-Li Su, Huan-Yi Hung, Han-Wen Chu, Tsung-Chou Hsu | 2015-05-19 |
| 8968595 | Methods for recycling liquid crystal and forming reformulated liquid crystal mixtures | Chien-Wei Lu, Huan-Yi Hung, Tsung-Chou Hsu, Chia-Lin Tsai, Meng-Yuh Chen | 2015-03-03 |
| 8035820 | Method and apparatus for resonant frequency identification through out-of-plane displacement detection | Liang-Chia Chen, Chung-Chu Chang, Jin-Liang Chen | 2011-10-11 |
| 7965394 | Method and apparatus for identifying dynamic characteristics of a vibratory object | Liang-Chia Chen, Chung-Chu Chang, Jin-Liang Chen | 2011-06-21 |
| 7782466 | Method and apparatus for resonant frequency identification through out-of-plane displacement detection | Liang-Chia Chen, Chung-Chu Chang, Jin-Liang Chen | 2010-08-24 |
| 7748111 | Manufacturing process of a carrier | Chien-Hao Wang, Kuo-Hsiang Lin | 2010-07-06 |
| 7656043 | Semiconductor package and method for manufacturing the same | — | 2010-02-02 |
| 7602053 | Leadframe of a leadless flip-chip package and method for manufacturing the same | Chih-Huang Chang | 2009-10-13 |
| 7575957 | Leadless semiconductor package and method for manufacturing the same | Chih-Te Lin | 2009-08-18 |
| 7536265 | Signal analysis method for vibratory interferometry | Liang-Chia Chen, Chung-Chu Chang, Jin-Liang Chen | 2009-05-19 |
| 7511366 | Multi-row substrate strip and method for manufacturing the same | Kuang-Lin Lo | 2009-03-31 |
| 7473629 | Substrate structure having a solder mask and a process for making the same | Wei-Chang Tai, Chi-Chih Chu, Meng-Jung Chuang, Cheng-Yin Lee, Kuang-Lin Lo | 2009-01-06 |
| 7335987 | Semiconductor package and method for manufacturing the same | — | 2008-02-26 |
| 7312105 | Leadframe of a leadless flip-chip package and method for manufacturing the same | Chih-Huang Chang | 2007-12-25 |
| 7157292 | Leadframe for a multi-chip package and method for manufacturing the same | — | 2007-01-02 |
| 7101733 | Leadframe with a chip pad for two-sided stacking and method for manufacturing the same | — | 2006-09-05 |
| 6722412 | Die bonder | Kuang-Chun Chou | 2004-04-20 |