Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289430 | Semiconductor package and a method for manufacturing the same | Bok-Sik Myung | 2022-03-29 |
| 10923465 | Semiconductor device having stacked semiconductor chips and method for fabricating the same | Dongwon Lee, Myung-Sung Kang, Hyein Yoo | 2021-02-16 |
| 10354985 | Semiconductor device having stacked semiconductor chips and method for fabricating the same | Dongwon Lee, Myung-Sung Kang, Hyein Yoo | 2019-07-16 |
| 10115613 | Method of fabricating a fan-out panel level package and a carrier tape film therefor | Yeongseok Kim, Hyein Yoo | 2018-10-30 |
| 8338962 | Semiconductor package substrate and semiconductor package having the same | Tae-Sung Park | 2012-12-25 |