| 6528351 |
Integrated package and methods for making same |
Richard J. Nathan |
2003-03-04 |
| 6034427 |
Ball grid array structure and method for packaging an integrated circuit chip |
James J. D. Lan, Steve S. Chiang, Paul Ying-Fung Wu, John Y. Xie, Hang Jiang |
2000-03-07 |
| 5962815 |
Antifuse interconnect between two conducting layers of a printed circuit board |
James J. D. Lan, Steve S. Chiang, Paul Ying-Fung Wu |
1999-10-05 |
| 5906042 |
Method and structure to interconnect traces of two conductive layers in a printed circuit board |
James J. D. Lan, Steve S. Chiang, Paul Ying-Fung Wu, John Y. Xie |
1999-05-25 |
| 5906043 |
Programmable/reprogrammable structure using fuses and antifuses |
James J. D. Lan, Steve S. Chiang, Paul Ying-Fung Wu |
1999-05-25 |
| 5834824 |
Use of conductive particles in a nonconductive body as an integrated circuit antifuse |
Steve S. Chiang, John Y. Xie |
1998-11-10 |
| 5808351 |
Programmable/reprogramable structure using fuses and antifuses |
Richard J. Nathan, James J. D. Lan, Steve S. Chiang |
1998-09-15 |
| 5767575 |
Ball grid array structure and method for packaging an integrated circuit chip |
James J. D. Lan, Steve S. Chiang, Paul Ying-Fung Wu, John Y. Xie, Hang Jiang |
1998-06-16 |
| 5536672 |
Fabrication of ferroelectric capacitor and memory cell |
William D. Miller, Joseph T. Evans, Jr., Wayne Kinney |
1996-07-16 |
| 5236550 |
Method for plasma etch of ruthenium |
Norman E. Abt |
1993-08-17 |
| 5046043 |
Ferroelectric capacitor and memory cell including barrier and isolation layers |
William D. Miller, Joseph T. Evans, Jr., Wayne Kinney |
1991-09-03 |
| 4982309 |
Electrodes for electrical ceramic oxide devices |
— |
1991-01-01 |