Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11895780 | Manufacturing method of package structure | Kai-Ming Yang, Chen-Hao Lin, Cheng-Ta Ko | 2024-02-06 |
| 11477886 | Circuit board structure and spliced circuit board | Yunn-Tzu Yu, Ching-Ho Hsieh | 2022-10-18 |
| 11127664 | Circuit board and manufacturing method thereof | Ra-Min Tain, Kai-Ming Yang, Tzyy-Jang Tseng | 2021-09-21 |
| 7968991 | Stacked package module and board having exposed ends | Lin-Yin Wong, Mao-Hua Yeh | 2011-06-28 |