Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11685014 | Formulations for advanced polishing pads | Sivapackia Ganapathiappan, Ankit Vora, Boyi Fu, Mayu YAMAMURA, Mario CORNEJO +5 more | 2023-06-27 |
| 10919123 | Piezo-electric end-pointing for 3D printed CMP pads | Rajeev Bajaj, Daniel Redfield | 2021-02-16 |
| 10875145 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more | 2020-12-29 |
| 10821573 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more | 2020-11-03 |
| 10384330 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more | 2019-08-20 |