Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10198333 | Test, validation, and debug architecture | Mark B. Trobough, Keshavan Tiruvallur, Chinna Prudvi, Christian Iovin, David W. Grawrock +37 more | 2019-02-05 |
| 9312237 | Integrated circuit package with spatially varied solder resist opening dimension | Sumit Kumar, Sridhar Nara, Renee D. Garcia, Manohar S. Konchady, Suresh Yeruva +3 more | 2016-04-12 |
| 8952532 | Integrated circuit package with spatially varied solder resist opening dimension | Sumit Kumar, Sridhar Nara, Renee D. Garcia, Manohar S. Konchady, Suresh Yeruva +3 more | 2015-02-10 |
| 8074354 | Method of making a self-balanced dual L-shaped socket | — | 2011-12-13 |
| 7695288 | Land grid array (LGA) socket with cells and method of fabrication and assembly | Xiaoqing Ma | 2010-04-13 |
| 7677902 | Extended package substrate | James A. Irvine | 2010-03-16 |
| 7604486 | Lateral force countering load mechanism for LGA sockets | Robert Martinson, Yupeng Li, Mandy G. Mistakawi, Thomas G. Ruttan | 2009-10-20 |
| 7524199 | Pick-and-place cap for socket assembly | Xiaoqing Ma | 2009-04-28 |
| 7497696 | Socket for land grid array package | Robert Martinson | 2009-03-03 |
| 7479015 | Socket assembly that includes improved contact arrangement | Thomas G. Ruttan | 2009-01-20 |
| 7429182 | Socket assembly for securing socket body | Xiaoqing Ma | 2008-09-30 |
| 7419383 | Self-balanced dual L-shaped socket | — | 2008-09-02 |
| 7278859 | Extended package substrate | James A. Irvine | 2007-10-09 |
| 7261572 | Self-balanced land grid array socket | — | 2007-08-28 |
| 7255494 | Low-profile package for housing an optoelectronic assembly | — | 2007-08-14 |
| 7255496 | Package for housing an optoelectronic assembly | Raghuram Narayan | 2007-08-14 |
| 7227248 | Stacked land grid array package | — | 2007-06-05 |
| 7223629 | Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header | Raghuram Narayan | 2007-05-29 |
| 7201521 | Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header | — | 2007-04-10 |
| 7176436 | Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header | Eric Zbinden | 2007-02-13 |
| 6992373 | Stacked land grid array package | — | 2006-01-31 |
| 6860652 | Package for housing an optoelectronic assembly | Raghuram Narayan | 2005-03-01 |