Issued Patents All Time
Showing 1–25 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12402255 | Method for producing electronic component mounted substrate | Shingo Okamura, Tadashi Maeda, Yuki YOSHIOKA | 2025-08-26 |
| 9999123 | Connection structure of circuit member, connection method, and connection material | Arata Kishi, Tadashi Maeda | 2018-06-12 |
| 9839143 | Electrode joining method, production method of electrode joined structure | Koji Motomura, Hideki Eifuku, Hiroki Maruo | 2017-12-05 |
| 9756728 | Component-mounted structure | Hideki Eifuku, Koji Motomura | 2017-09-05 |
| 9609760 | Electronic component mounting method | Tsubasa Saeki, Yoshiyuki Wada, Koji Motomura | 2017-03-28 |
| 9516749 | Electronic component-mounted structure, IC card and COF package | Yoshiyuki Wada, Koji Motomura | 2016-12-06 |
| 9015932 | Connecting method of electronic component | Hideki Eifuku | 2015-04-28 |
| 8960526 | Flux for soldering and soldering process | Tadashi Maeda | 2015-02-24 |
| 8851138 | Substrate backing device and substrate thermocompression-bonding device | Hiroki Maruo, Koji Motomura, Hideki Eifuku | 2014-10-07 |
| 8817487 | Electronic component mounting system and electronic component mounting method | Koji Motomura, Hideki Eifuku | 2014-08-26 |
| 8759688 | Electronic component mounting structure | Seiichi Yoshinaga, Yoshiyuki Wada | 2014-06-24 |
| 8686299 | Electronic element unit and reinforcing adhesive agent | Koji Motomura, Seiichi Yoshinaga | 2014-04-01 |
| 8499998 | Component built-in circuit substrate and method of producing the same | Yoshiyuki Wada | 2013-08-06 |
| 8434665 | Electronic component mounting system and electronic component mounting method | Koji Motomura, Hideki Eifuku | 2013-05-07 |
| 8367938 | Method of bonding core wires to electrodes and electronic unit formed by bonding electrodes and core wires | — | 2013-02-05 |
| 8188605 | Components joining method and components joining structure | Hideki Eifuku, Yoshiyuki Wada | 2012-05-29 |
| 8148253 | Electronic component soldering structure and electronic component soldering method | Mitsuru Ozono, Hideki Eifuku | 2012-04-03 |
| 8083121 | Paste for soldering and soldering method using the same | Tadashi Maeda | 2011-12-27 |
| 8034447 | Electronic components mounting adhesive and electronic components mounting structure | Hideki Eifuku, Kouji Motomura | 2011-10-11 |
| 8025205 | Electronic component mounting method | Hideki Eifuku, Osamu Suzuki, Satomi Kawamoto | 2011-09-27 |
| 8018074 | Components joining method and components joining structure | Hideki Eifuku, Yoshiyuki Wada | 2011-09-13 |
| 7966721 | Electronic component mounting method and electronic component mounting device | Yoshiyuki Wada | 2011-06-28 |
| 7886432 | Electric components connecting method | Hideki Eifuku | 2011-02-15 |
| 7845074 | Method for manufacturing electronic parts module | Koji Motomura, Hideki Eifuku | 2010-12-07 |
| 7841081 | Method for manufacturing electronic parts module | Koji Motomura, Hideki Eifuku | 2010-11-30 |