Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835598 | Stacked semiconductor module and method of manufacturing the same | Joong-Hyun Baek, Jin-Yang Lee, Yun-Hyeok Im | 2004-12-28 |
| 6781849 | Multi-chip package having improved heat spread characteristics and method for manufacturing the same | Joong-Hyun Baek, Min-ha Kim, Yun-Hyeok Im | 2004-08-24 |
| 6326686 | Vertical semiconductor device package having printed circuit board and heat spreader, and module having the packages | Joong-Hyun Baek, Il Gyu Jung, Chang Ho Cho | 2001-12-04 |
| 5660318 | Apparatus for inner lead bonding (ILB) comprising a heat dissipation pin and method of ILB using such an apparatus | Il Gyu Jung, Tae-Gyeong Chung | 1997-08-26 |