| 8003494 |
Method for producing a bonded wafer |
Hideki Nishihata, Nobuyuki Morimoto, Akihiko Endo |
2011-08-23 |
| 7939441 |
P-type silicon wafer and method for heat-treating the same |
Hidehiko Okuda |
2011-05-10 |
| 7927957 |
Method for producing bonded silicon wafer |
Akihiko Endo, Hideki Nishihata, Nobuyuki Morimoto |
2011-04-19 |
| 7927972 |
Method for producing bonded wafer |
Akihiko Endo |
2011-04-19 |
| 7767549 |
Method of manufacturing bonded wafer |
Hidehiko Okuda, Akihiko Endo |
2010-08-03 |
| 7763541 |
Process for regenerating layer transferred wafer |
Hidehiko Okuda, Akihiko Endo |
2010-07-27 |
| 7745306 |
Method for producing bonded wafer |
Hidehiko Okuda |
2010-06-29 |
| 7718509 |
Method for producing bonded wafer |
Akihiko Endo |
2010-05-18 |
| 7601227 |
High purification method of jig for semiconductor heat treatment |
— |
2009-10-13 |
| 7541663 |
P-type silicon wafer and method for heat-treating the same |
Hidehiko Okuda |
2009-06-02 |
| 7534728 |
Process for cleaning silicon substrate |
Hideki Nishihata, Nobuyuki Morimoto |
2009-05-19 |
| 7442623 |
Method for manufacturing bonded substrate and bonded substrate manufactured by the method |
Akihiko Endo |
2008-10-28 |
| 7416960 |
Method for manufacturing SOI substrate |
Akihiko Endo, Hidehiko Okuda, Etsurou Morita |
2008-08-26 |
| 7364984 |
Method for manufacturing SOI substrate |
Akihiko Endo, Hidehiko Okuda, Etsurou Morita |
2008-04-29 |
| 7354844 |
Method for manufacturing SOI substrate |
Akihiko Endo, Hidehiko Okuda, Etsurou Morita |
2008-04-08 |
| 7311775 |
Method for heat-treating silicon wafer and silicon wafer |
Hidehiko Okuda, Yoshihisa Nonogaki |
2007-12-25 |