Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5953814 | Process for producing flip chip circuit board assembly exhibiting enhanced reliability | Wayne Anthony Sozansky, Michael D. Gibson, Michael Patrick Meehan, Darrel E. Peugh, James M. Rosson +2 more | 1999-09-21 |
| 5547740 | Solderable contacts for flip chip integrated circuit devices | William D. Higdon, Ralph Edward Cornell | 1996-08-20 |