Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10793711 | Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same | Yoon Man Lee, Jae-Hyun Kim, Tae Shin EOM, Eun Jung Lee | 2020-10-06 |
| 8557896 | Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film | Chul Ho Jeong, Ki Tae Song, Han Nim Choi, Ah Ram Pyun, Sang Jin Kim | 2013-10-15 |
| 8394493 | Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same | Yong Woo Hong, Wan Jung Kim, Ki Sung Jung, Chang Beom Chung | 2013-03-12 |
| 8211540 | Adhesive film composition, associated dicing die bonding film, die package, and associated methods | Yong Woo Hong, Ki Seong Jung, Wan Jung Kim, Sang Jin Kim, Chang Beom Chung | 2012-07-03 |
| 7863758 | Adhesive film composition, associated dicing die bonding film, and die package | Ki Sung Jung, Wan Jung Kim, Yong Woo Hong, Chang Bum Chung, Chul Ho Jeong +2 more | 2011-01-04 |