Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9109147 | Adhesive composition for semiconductor and adhesive film comprising the same | Baek Soung PARK, Dong Seon Uh, In Hwan Kim | 2015-08-18 |
| 8946343 | Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the film | Baek Soung PARK, In Hwan Kim | 2015-02-03 |
| 8623512 | Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device including the adhesive film | Ah Ram Pyun, Jae Hyun Cho | 2014-01-07 |
| 8609515 | Dicing die bonding film, semiconductor wafer, and semiconductor device | Min Hwang, Ji Ho Kim | 2013-12-17 |
| 8557896 | Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film | Chul Ho Jeong, Han Nim Choi, Su Mi Im, Ah Ram Pyun, Sang Jin Kim | 2013-10-15 |
| 8243870 | Apparatus for removing thermal sleeve from cold leg of reactor coolant system | Won Jong BAEK, Sung Ho JANG, Bum-Suk Lee | 2012-08-14 |