Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8394493 | Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same | Su Mi Im, Wan Jung Kim, Ki Sung Jung, Chang Beom Chung | 2013-03-12 |
| 8211540 | Adhesive film composition, associated dicing die bonding film, die package, and associated methods | Ki Seong Jung, Wan Jung Kim, Su Mi Im, Sang Jin Kim, Chang Beom Chung | 2012-07-03 |
| 7863758 | Adhesive film composition, associated dicing die bonding film, and die package | Ki Sung Jung, Wan Jung Kim, Chang Bum Chung, Chul Ho Jeong, Ah Ram Pyun +2 more | 2011-01-04 |