Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8211540 | Adhesive film composition, associated dicing die bonding film, die package, and associated methods | Yong Woo Hong, Wan Jung Kim, Su Mi Im, Sang Jin Kim, Chang Beom Chung | 2012-07-03 |