Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8394493 | Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same | Yong Woo Hong, Su Mi Im, Wan Jung Kim, Ki Sung Jung | 2013-03-12 |
| 8309219 | Multi-function tape for a semiconductor package and method of manufacturing a semiconductor device using the same | Yong Ha Hwang, Jae Hyun Cho, Gyu Seok Song | 2012-11-13 |
| 8211540 | Adhesive film composition, associated dicing die bonding film, die package, and associated methods | Yong Woo Hong, Ki Seong Jung, Wan Jung Kim, Su Mi Im, Sang Jin Kim | 2012-07-03 |
| 8193259 | UV-curable pressure-sensitive adhesive composition with a fluorinated acrylic binder resin and pressure-sensitive adhesive film using the same | Seung Jib Choi, Kyoung Jin Ha, Jun Suk Kim, Kyung Ju Lee | 2012-06-05 |