Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5620782 | Method of fabricating a flex laminate package | Charles R. Davis, Thomas P. Duffy, Howard L. Heck, John T. Kolias, John S. Kresge +2 more | 1997-04-15 |
| 5509196 | Method of fabricating a flex laminate package | Charles R. Davis, Thomas P. Duffy, Howard L. Heck, John T. Kolias, John S. Kresge +2 more | 1996-04-23 |
| 5384690 | Flex laminate package for a parallel processor | Charles R. Davis, Thomas P. Duffy, Howard L. Heck, John T. Kolias, John S. Kresge +2 more | 1995-01-24 |
| 5316788 | Applying solder to high density substrates | Eric P. Dibble, Voya R. Markovich, Daniel S. Niedrich, Gary Paul Vlasak, Richard Stuart Zarr +1 more | 1994-05-31 |