Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11702335 | Low stress integrated device package | Yeonsung Kim, Thomas M. Goida | 2023-07-18 |
| 9731959 | Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same | Dipak Sengupta | 2017-08-15 |
| 8853839 | Air-release features in cavity packages | Jia Gao, Jicheng Yang, Siu Lung Ng, Xiaojie Xue | 2014-10-07 |