Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12025926 | Electrophotographic member and heat fixing device | Yasuhiro Miyahara, Matsutaka Maeda, Yuji Kitano, Makoto Souma, Yutaro Yoshida | 2024-07-02 |
| 11841630 | Fixing member and heat fixing device | Yuji Kitano, Matsutaka Maeda, Makoto Souma, Yutaro Yoshida, Yasuhiro Miyahara | 2023-12-12 |
| 11573515 | Fixing member and heat fixing apparatus | Yasuhiro Miyahara, Matsutaka Maeda, Yuji Kitano, Makoto Souma, Yutaro Yoshida | 2023-02-07 |
| 11556082 | Intermediary transfer belt, manufacturing method of the intermediary transfer belt, and image forming apparatus | Ryosuke Tsuruga, Toshiyuki Yoshida, Jun Ohira, Akeshi Asaka, Hiroto Sugimoto +11 more | 2023-01-17 |
| 5309011 | Wafer scale or full wafer memory system, packaging method thereof, and wafer processing method employed therein | Masanori Tazunoki, Hiromitsu Mishimagi, Makoto Homma, Toshiyuki Sakuta, Hisashi Nakamura +8 more | 1994-05-03 |
| 5223454 | Method of manufacturing semiconductor integrated circuit device | Takayuki Uda, Tasuku Tanaka, Yoshiaki Emoto | 1993-06-29 |
| 5191224 | Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein | Masanori Tazunoki, Hiromitsu Mishimagi, Makoto Homma, Toshiyuki Sakuta, Hisashi Nakamura +8 more | 1993-03-02 |
| 5141888 | Process of manufacturing semiconductor integrated circuit device having trench and field isolation regions | Mikinori Kawaji, Toshihiko Takakura, Akihisa Uchida, Yoichi Tamaki, Takeo Shiba +2 more | 1992-08-25 |
| 5067007 | Semiconductor device having leads for mounting to a surface of a printed circuit board | Kanji Otsuka, Masao Kato, Takashi Kumagai, Mitsuo Usami, Kunizo Sahara +7 more | 1991-11-19 |
| 5049972 | Method of manufacturing semiconductor integrated circuit device | Takayuki Uda, Tasuku Tanaka, Yoshiaki Emoto | 1991-09-17 |
| 5011788 | Process of manufacturing semiconductor integrated circuit device and product formed thereby | Mikinori Kawaji, Toshihiko Takakura, Akihisa Uchida, Yoichi Tamaki, Takeo Shiba +2 more | 1991-04-30 |
| 4965653 | Semiconductor device and method of mounting the semiconductor device | Kanji Otsuka, Katsuyuki Sato, Hisashi Nakamura, Shinichi Shouji | 1990-10-23 |
| 4819054 | Semiconductor IC with dual groove isolation | Mikinori Kawaji, Toshihiko Takakura, Akihisa Uchida, Yoichi Tamaki, Takeo Shiba +2 more | 1989-04-04 |
| 4739125 | Electric component part having lead terminals | Yutaka Watanabe, Fumiyuki Kobayashi, Masao Sekibata, Akio Yasukawa, Shigejiro Sekine | 1988-04-19 |
| 4469535 | Method of fabricating semiconductor integrated circuit devices | Takahiko Takahashi, Akio Anzai | 1984-09-04 |