Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9978616 | Pressing apparatus, substrate bonding apparatus and stacked substrate | Satoshi Takahashi | 2018-05-22 |
| 9498944 | Pressuring module, pressuring apparatus, substrate bonding apparatus, substrate bonding method, and bonded substrate | — | 2016-11-22 |
| 8794287 | Wafer bonding apparatus | — | 2014-08-05 |
| 8206525 | Wafer bonding apparatus | — | 2012-06-26 |
| 7175508 | Polishing apparatus, method of manufacturing semiconductor device using the same, and semiconductor device manufactured by this method | — | 2007-02-13 |
| 7175504 | Vacuum suction holding apparatus and holding method, polishing apparatus using this holding apparatus, and device manufacturing method using this polishing apparatus | Hiroshi Arai | 2007-02-13 |
| 6273803 | Carriers and polishing apparatus | Xu-Jin Wang, Misuo Sugiyama, Hideo Tanaka | 2001-08-14 |
| 6062954 | Semiconductor wafer surface flattening apparatus | — | 2000-05-16 |
| 6030488 | Chemical and mechanical polishing apparatus | Hatsuyuki Arai | 2000-02-29 |
| 6012964 | Carrier and CMP apparatus | Hatsuyuki Arai, Xu-Jin Wang, Misuo Sugiyama, Hisato Matsubara, Hideo Tanaka +1 more | 2000-01-11 |
| 5916009 | Apparatus for applying an urging force to a wafer | Hatsuyuki Arai | 1999-06-29 |