Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7065721 | Optimized bond out method for flip chip wafers | Atila Mertol, Wilson Choi | 2006-06-20 |
| 6818996 | Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps | Atila Mertol | 2004-11-16 |
| 6700207 | Flip-chip ball grid array package for electromigration testing | Anand Govind, Carl Iwashita | 2004-03-02 |
| 6466038 | Non-isothermal electromigration testing of microelectronic packaging interconnects | Sunil A. Patel | 2002-10-15 |
| 6403399 | Method of rapid wafer bumping | Kang-rong Chiang | 2002-06-11 |