| 11515265 |
Fan-out semiconductor package |
Myung Sam Kang, Jin Gu Kim |
2022-11-29 |
| 11075193 |
Semiconductor package |
Myung Sam Kang, Young Gwan Ko, Yong Jin Park |
2021-07-27 |
| 10748856 |
Fan-out semiconductor package |
Myung Sam Kang, Jin Gu Kim |
2020-08-18 |
| 10727212 |
Semiconductor package |
Myung Sam Kang, Young Gwan Ko, Chang Bae Lee, Jin Su Kim |
2020-07-28 |
| 9345142 |
Chip embedded board and method of manufacturing the same |
Young Do Kweon, Jeong Ho Lee |
2016-05-17 |
| 9196506 |
Method for manufacturing interposer |
Hyung Jin Jeon, Jong In Ryu, Seung Wan Shin, Young Do Kweon, Seung Wook Park |
2015-11-24 |
| 8756804 |
Method of manufacturing printed circuit board |
Hyung Jin Jeon, Young Do Kweon, Seung Wook Park |
2014-06-24 |
| 8624128 |
Printed circuit board and manufacturing method thereof |
Ju Pyo Hong, Young Do Kweon, Jin Gu Kim, Dong Jin Lee, Seung Wook Park |
2014-01-07 |
| 8273660 |
Method of manufacturing a dual face package |
Seung Wook Park, Young Do Kweon, Jingli Yuan, Ju Pyo Hong, Jae Kwang Lee |
2012-09-25 |
| 8093705 |
Dual face package having resin insulating layer |
Seung Wook Park, Young Do Kweon, Jingli Yuan, Ju Pyo Hong, Jae Kwang Lee |
2012-01-10 |
| 7947530 |
Method of manufacturing wafer level package including coating and removing resin over the dicing lines |
Jin Gu Kim, Young Do Kweon, Hyung Jin Jeon, Seung Wook Park, Hee Kon Lee |
2011-05-24 |
