Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412811 | Split via structure for semiconductor device packaging | Hong Wan Ng, Seng Kim Ye, Kelvin Tan Aik Boo, Ling Pan | 2025-09-09 |
| 9324676 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Liang Chee Tay | 2016-04-26 |
| 9147623 | Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices | Edmund Koon Tian Lua, Choon Kuan Lee | 2015-09-29 |
| 8900923 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Liang Chee Tay | 2014-12-02 |
| 8803307 | Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices | Edmund Koon Tian Lua, Choon Kuan Lee | 2014-08-12 |
| 8501546 | Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices | Edmund Koon Tian Lua, Choon Kuan Lee | 2013-08-06 |
| 8399971 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Liang Chee Tay | 2013-03-19 |
| 8093702 | Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices | Edmund Koon Tian Lua, Choon Kuan Lee | 2012-01-10 |
| 7741150 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Liang Chee Tay | 2010-06-22 |