| 9455235 |
Thin embedded packages, methods of fabricating the same, electronic systems including the same, and memory cards including the same |
— |
2016-09-27 |
| 9345136 |
Package substrates, semiconductor packages including the same, electronic systems including the same, and memory cards including the same |
Won Duck JUNG |
2016-05-17 |
| 9324688 |
Embedded packages having a connection joint group |
Ki Jun SUNG, Jong Hyun Nam, Sang Yong Lee, Young Geun Yoo |
2016-04-26 |
| 9263417 |
Semiconductor packages including a multi-layered dielectric layer and methods of manufacturing the same |
— |
2016-02-16 |
| 9252136 |
Package stacked device |
Qwan Ho CHUNG |
2016-02-02 |
| 9209150 |
Embedded packages, methods of fabricating the same, electronic systems including the same, and memory cards including the same |
Sang Yong Lee, Qwan Ho CHUNG, Jong Hyun Nam, Si-Han Kim |
2015-12-08 |
| 9209146 |
Electronic device packages having bumps and methods of manufacturing the same |
Qwan Ho CHUNG, Jong Hyun Nam, Si-Han Kim, Sang Yong Lee, Seong Cheol Shin |
2015-12-08 |
| 9153557 |
Chip stack embedded packages |
Ki Jun SUNG, Jong Hyun Nam, Sang Yong Lee, Young Geun Yoo |
2015-10-06 |
| 9064862 |
Semiconductor chips having a dual-layered structure, packages having the same, and methods of fabricating the semiconductor chips and the packages |
In-chul Hwang, Jae Myun Kim, Jin Su Lee |
2015-06-23 |
| 8987900 |
Embedded packages including a multi-layered dielectric layer and methods of manufacturing the same |
— |
2015-03-24 |
| 8907487 |
Electronic device packages having bumps and methods of manufacturing the same |
Qwan Ho CHUNG, Jong Hyun Nam, Si-Han Kim, Sang Yong Lee, Seong Cheol Shin |
2014-12-09 |
| 8492889 |
Semiconductor package |
Jae Myun Kim, Ki Bum Kim |
2013-07-23 |
| 8390114 |
Semiconductor package |
Jae Myun Kim, Ki Bum Kim |
2013-03-05 |
| 7989943 |
Staircase shaped stacked semiconductor package |
Jae Myun Kim, Kyoung-mo Yang |
2011-08-02 |