Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553508 | Semiconductor manufacturing using disposable test circuitry within scribe lanes | Douglas M. Reber, Phuc M. Nguyen | 2020-02-04 |
| 10522615 | Semiconductor package with embedded capacitor and methods of manufacturing same | Phuc M. Nguyen, Douglas M. Reber | 2019-12-31 |
| 9601354 | Semiconductor manufacturing for forming bond pads and seal rings | Douglas M. Reber, Phuc M. Nguyen | 2017-03-21 |
| 9548266 | Semiconductor package with embedded capacitor and methods of manufacturing same | Phuc M. Nyugen, Douglas M. Reber | 2017-01-17 |
| 9134366 | Method for forming a packaged semiconductor device | Phuc M. Nguyen, Douglas M. Reber | 2015-09-15 |
| 8059380 | Package level ESD protection and method therefor | Melanie Etherton, Marc Alan Mangrum | 2011-11-15 |
| 5963818 | Combined trench isolation and inlaid process for integrated circuit formation | Soolin Kao, Diann Dow, Susan E. Soggs | 1999-10-05 |
| 5885870 | Method for forming a semiconductor device having a nitrided oxide dielectric layer | Bikas Maiti, Philip J. Tobin | 1999-03-23 |
| 5837612 | Silicon chemical mechanical polish etch (CMP) stop for reduced trench fill erosion and method for formation | Soolin Kao | 1998-11-17 |
| 5736435 | Process for fabricating a fully self-aligned soi mosfet | Suresh Venkatesan, Stephen S. Poon, Jeffrey W. Lutze | 1998-04-07 |
| 5665620 | Method for forming concurrent top oxides using reoxidized silicon in an EPROM | Bich-Yen Nguyen, Wayne M. Paulson, Jon Dahm | 1997-09-09 |
| 5510645 | Semiconductor structure having an air region and method of forming the semiconductor structure | Jon T. Fitch, Papu D. Maniar, Keith E. Witek, Jerry Gelatos, Reza Moazzami | 1996-04-23 |
| 5324683 | Method of forming a semiconductor structure having an air region | Jon T. Fitch, Papu D. Maniar, Keith E. Witek, Jerry Gelatos, Reza Moazzami | 1994-06-28 |