Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7315080 | Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader | Chun Ho Fan, Wing Keung Lam, Ming Wang Sze, Neil McLellan, Mohan Kirloskar | 2008-01-01 |
| 6987032 | Ball grid array package and process for manufacturing same | Chun Ho Fan, Wing Keung Lam, Ming Wang Sze, Neil McLellan, Mohan Kirloskar | 2006-01-17 |
| 6982491 | Sensor semiconductor package and method of manufacturing the same | Chun Ho Fan, Lap Keung Chow | 2006-01-03 |
| 6979594 | Process for manufacturing ball grid array package | Chun Ho Fan, Ming Wang Sze | 2005-12-27 |
| 6790710 | Method of manufacturing an integrated circuit package | Neil McLellan, Chun Ho Fan, Edward Combs, Tsang Cheung, Chow Keung | 2004-09-14 |