Issued Patents All Time
Showing 25 most recent of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424455 | Seal ring designs supporting efficient die to die routing | Chi Nung Ni, Long Huang, SivaChandra Jangam | 2025-09-23 |
| 12322730 | Wafer reconstitution and die-stitching | Jun Zhai, Kwan-Yu Lai, Kunzhong Hu, Vidhya Ramachandran | 2025-06-03 |
| 12261132 | Structure and method for sealing a silicon IC | Vidhya Ramachandran, SivaChandra Jangam, Jun Zhai, Kunzhong Hu | 2025-03-25 |
| 12237269 | Scalable large system based on organic interconnect | Ravindranath Kollipara | 2025-02-25 |
| 12176803 | Decoupling device using stored charge reverse recovery | Chi Nung Ni | 2024-12-24 |
| 12159835 | High density 3D interconnect configuration | Zhitao Cao, Kunzhong Hu, Jun Zhai | 2024-12-03 |
| 12119304 | Very fine pitch and wiring density organic side by side chiplet integration | Zhitao Cao, Kunzhong Hu | 2024-10-15 |
| 12087689 | Selectable monolithic or external scalable die-to-die interconnection system methodology | Jun Zhai, Jung-Cheng Yeh, Kunzhong Hu, Raymundo M. Camenforte, Thomas Hoffmann | 2024-09-10 |
| 12021035 | Interconnecting dies by stitch routing | Jun Zhai | 2024-06-25 |
| 11862557 | Selectable monolithic or external scalable die-to-die interconnection system methodology | Jun Zhai, Jung-Cheng Yeh, Kunzhong Hu, Raymundo M. Camenforte, Thomas Hoffmann | 2024-01-02 |
| 11862481 | Seal ring designs supporting efficient die to die routing | Chi Nung Ni, Long Huang, SivaChandra Jangam | 2024-01-02 |
| 11831312 | Systems and methods for implementing a scalable system | Bahattin Kilic, Jie Zhao, Kunzhong Hu, Suk-Kyu Ryu | 2023-11-28 |
| 11824015 | Structure and method for sealing a silicon IC | Vidhya Ramachandran, SivaChandra Jangam, Jun Zhai, Kunzhong Hu | 2023-11-21 |
| 11811303 | Decoupling device using stored charge reverse recovery | Chi Nung Ni | 2023-11-07 |
| 11735567 | Wafer reconstitution and die-stitching | Jun Zhai, Kwan-Yu Lai, Kunzhong Hu, Vidhya Ramachandran | 2023-08-22 |
| 11735526 | High density 3D interconnect configuration | Zhitao Cao, Kunzhong Hu, Jun Zhai | 2023-08-22 |
| 11728266 | Die stitching and harvesting of arrayed structures | Jun Zhai, Kunzhong Hu, Raymundo M. Camenforte | 2023-08-15 |
| 11699949 | Power management system switched capacitor voltage regulator with integrated passive device | David A. Secker, Jun Zhai, Ralf M. Schmitt, Vidhya Ramachandran, Wenjie Mao | 2023-07-11 |
| 11476203 | Die-to-die routing through a seal ring | Jun Zhai | 2022-10-18 |
| 11309246 | High density 3D interconnect configuration | Zhitao Cao, Kunzhong Hu, Jun Zhai | 2022-04-19 |
| 11309895 | Systems and methods for implementing a scalable system | Bahattin Kilic, Jie Zhao, Kunzhong Hu, Suk-Kyu Ryu | 2022-04-19 |
| 11158607 | Wafer reconstitution and die-stitching | Jun Zhai, Kwan-Yu Lai, Kunzhong Hu, Vidhya Ramachandran | 2021-10-26 |
| 11101732 | Power management system switched capacitor voltage regulator with integrated passive device | David A. Secker, Jun Zhai, Ralf M. Schmitt, Vidhya Ramachandran, Wenjie Mao | 2021-08-24 |
| 10985107 | Systems and methods for forming die sets with die-to-die routing and metallic seals | Jun Zhai | 2021-04-20 |
| 10756622 | Power management system switched capacitor voltage regulator with integrated passive device | David A. Secker, Jun Zhai, Ralf M. Schmitt, Vidhya Ramachandran, Wenjie Mao | 2020-08-25 |