Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11818835 | Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foil | Hiroaki Takahashi, Kiyotaka Komori, Masaya Koyama, Jun Tochihira | 2023-11-14 |
| 10822527 | Thermosetting adhesive composition, thermosetting adhesive film, and composite film | Jun Tochihira | 2020-11-03 |
| 10751976 | Resin-clad metal foil and flexible printed wiring board | Yohsuke Ishikawa, Yoshiaki Esaki, Takayoshi Ozeki, Jun Tochihira | 2020-08-25 |
| 10568201 | Multilayer printed wiring board and multilayer metal clad laminated board | Hiroaki Takahashi, Tomoyuki Aoki, Kiyotaka Komori, Jun Tochihira | 2020-02-18 |