Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12042864 | Thermally decomposing build plate with casting mold for facile release of 3D printed objects | David P. Socha, Geoff Beckwith | 2024-07-23 |
| 6943113 | Metal chemical polishing process for minimizing dishing during semiconductor wafer fabrication | Chenting Lin | 2005-09-13 |
| 6124206 | Reduced pad erosion | Bertrand Flietner, Monika Gschoederer | 2000-09-26 |
| 6051497 | Formation of sub-groundrule features | — | 2000-04-18 |
| 5972787 | CMP process using indicator areas to determine endpoint | Karl E. Boggs, Chenting Lin, Joachim Nuetzel, Maria Ronay, Florian Schnabel +1 more | 1999-10-26 |
| 5907771 | Reduction of pad erosion | Bertrand Flienter | 1999-05-25 |
| 5885137 | Chemical mechanical polishing pad conditioner | — | 1999-03-23 |