RG

Robin E. Gorrell

3M: 8 patents #1,961 of 11,543Top 20%
WG W.L. Gore & Associates Gmbh: 6 patents #149 of 1,175Top 15%
SP Supercomputer Systems Limited Partnership: 1 patents #27 of 59Top 50%
Overall (All Time): #309,597 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12381107 Protective tapes, articles therefrom, and methods of making and using same Shujun Wang, Roger A. Grisle, Richard Y. Liu, Yaoyao Chen 2025-08-05
11324113 Electrical conductors Nicholas T. Gabriel, Ronald D. Jesme, Andrew J. Ouderkirk, Ravi Palaniswamy, Andrew P. Bonifas +2 more 2022-05-03
11164063 Multilayer stack including RFID tag John D. Geissinger, Donald G. Peterson, Howard M. Kaplan 2021-11-02
10740669 Film assembly and multilayer stack including antenna John D. Geissinger, Donald G. Peterson, Howard M. Kaplan 2020-08-11
10653006 Electrical conductors Nicholas T. Gabriel, Ronald D. Jesme, Andrew J. Ouderkirk, Ravi Palaniswamy, Andrew P. Bonifas +2 more 2020-05-12
10628727 RFID tag on stretchable substrate John D. Geissinger, Howard M. Kaplan 2020-04-21
10496915 RFID tag on flexible substrate John D. Geissinger, Donald G. Peterson, Howard M. Kaplan 2019-12-03
10229353 RFID tag on stretchable substrate John D. Geissinger, Howard M. Kaplan 2019-03-12
6344371 Dimensionally stable core for use in high density chip packages and a method of fabricating same Paul J. Fischer, Mark F. Sylvester 2002-02-05
5976974 Method of forming redundant signal traces and corresponding electronic components Paul J. Fischer 1999-11-02
5965043 Method for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-vias David B. Noddin, Michael R. Leaf 1999-10-12
5847327 Dimensionally stable core for use in high density chip packages Paul J. Fischer, Mark F. Sylvester 1998-12-08
5786270 Method of forming raised metallic contacts on electrical circuits for permanent bonding Paul J. Fischer 1998-07-28
5747358 Method of forming raised metallic contacts on electrical circuits Paul J. Fischer 1998-05-05
5276955 Multilayer interconnect system for an area array interconnection using solid state diffusion David B. Noddin, William George Petefish, Kevin L. Stumpe, Boydd Piper, Deepak Swamy +2 more 1994-01-11