Issued Patents All Time
Showing 25 most recent of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11669482 | Low-pincount high-bandwidth memory and memory bus | — | 2023-06-06 |
| 11086811 | Low-pincount high-bandwidth memory and memory bus | — | 2021-08-10 |
| 10692842 | Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2020-06-23 |
| 10643977 | Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2020-05-05 |
| 10642776 | Low-pincount high-bandwidth memory and memory bus | — | 2020-05-05 |
| 10380060 | Low-pincount high-bandwidth memory and memory bus | — | 2019-08-13 |
| 10090280 | Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2018-10-02 |
| 10032752 | Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2018-07-24 |
| 10008477 | Microelectronic element with bond elements to encapsulation surface | Belgacem Haba, Wael Zohni | 2018-06-26 |
| 9806017 | Flip-chip, face-up and face-down centerbond memory wirebond assemblies | Belgacem Haba, Wael Zohni | 2017-10-31 |
| 9728495 | Reconfigurable PoP | Belgacem Haba, Wael Zohni | 2017-08-08 |
| 9679838 | Stub minimization for assemblies without wirebonds to package substrate | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2017-06-13 |
| 9679876 | Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2017-06-13 |
| 9530458 | Stub minimization using duplicate sets of signal terminals | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2016-12-27 |
| 9515053 | Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2016-12-06 |
| 9508629 | Memory module in a package | Belgacem Haba, Wael Zohni, Ilyas Mohammed | 2016-11-29 |
| 9496243 | Microelectronic assembly with opposing microelectronic packages each having terminals with signal assignments that mirror each other with respect to a central axis | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2016-11-15 |
| 9466587 | Multiple die in a face down package | Belgacem Haba, Wael Zohni | 2016-10-11 |
| 9461015 | Enhanced stacked microelectronic assemblies with central contacts | Belgacem Haba, Wael Zohni | 2016-10-04 |
| 9460758 | Single package dual channel memory with co-support | Yong-Syuan Chen, Belgacem Haba, Wael Zohni, Zhuowen Sun | 2016-10-04 |
| 9437579 | Multiple die face-down stacking for two or more die | Belgacem Haba, Wael Zohni, Ilyas Mohammed, Frank Lambrecht | 2016-09-06 |
| 9423824 | Stub minimization for multi-die wirebond assemblies with parallel windows | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2016-08-23 |
| 9377824 | Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2016-06-28 |
| 9373565 | Stub minimization for assemblies without wirebonds to package substrate | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2016-06-21 |
| 9368477 | Co-support circuit panel and microelectronic packages | Belgacem Haba, Wael Zohni | 2016-06-14 |