Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7880310 | Direct device attachment on dual-mode wirebond die | — | 2011-02-01 |
| 7262513 | Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon | — | 2007-08-28 |
| 7102703 | Liquid crystal display assembly for reducing optical defects | Hem Takiar, Cade Murray, Tonya Fridlyand | 2006-09-05 |
| 6927156 | Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon | — | 2005-08-09 |
| 6556269 | Connection assembly for reflective liquid crystal display and method | Hem Takiar | 2003-04-29 |
| 6498636 | Apparatus and method for substantially stress-free electrical connection to a liquid crystal display | G. Cade Murray | 2002-12-24 |
| 6476885 | Stress-free socketed optical display package with die non-rigidly attached to containment structure | G. Cade Murray | 2002-11-05 |
| 6459143 | Method of packaging fuses | Inderjit Singh, Hem Takiar, Nikhil Vishwanath Kelkar | 2002-10-01 |
| 6384890 | Connection assembly for reflective liquid crystal projection with branched PCB display | Hem Takiar | 2002-05-07 |
| 6357763 | Seal for LCD devices and methods for making same | Boonmi Mekdhanasarn | 2002-03-19 |
| 6356334 | Liquid crystal display assembly and method for reducing residual stresses | Seshadri Vikram | 2002-03-12 |
| 6284566 | Chip scale package and method for manufacture thereof | Shaw Wei Lee, Hem Takiar | 2001-09-04 |
| 6255141 | Method of packaging fuses | Inderjit Singh, Hem Takiar, Nikhil Vishwanath Kelkar | 2001-07-03 |
| 6140708 | Chip scale package and method for manufacture thereof | Shaw Wei Lee, Hem Takiar | 2000-10-31 |
| 6122033 | Fusible seal for LCD devices and methods for making same | Hem Takiar | 2000-09-19 |
| 6054338 | Low cost ball grid array device and method of manufacture thereof | Shaw Wei Lee, Hem Takiar, Hee Jhin Kim | 2000-04-25 |
| 5969783 | Reflective liquid crystal display and connection assembly and method | Hem Takiar | 1999-10-19 |
| 5923995 | Methods and apparatuses for singulation of microelectromechanical systems | Pai-Hsiang Kao, Cornelio De Vera | 1999-07-13 |
| 5832585 | Method of separating micro-devices formed on a substrate | Hem Takiar | 1998-11-10 |
| 5804880 | Solder isolating lead frame | — | 1998-09-08 |
| 5783866 | Low cost ball grid array device and method of manufacture thereof | Shaw Wei Lee, Hem Takiar, Hee Jhin Kim | 1998-07-21 |
| 5728285 | Protective coating combination for lead frames | — | 1998-03-17 |
| 5650661 | Protective coating combination for lead frames | — | 1997-07-22 |
| 5596225 | Leadframe for an integrated circuit package which electrically interconnects multiple integrated circuit die | Hem Takiar | 1997-01-21 |
| 5436082 | Protective coating combination for lead frames | — | 1995-07-25 |