Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276282 | Coaxial transmission line structure | Angelo M. Puzella, Lance A. Auer, Donald A. Bozza, John B. Francis, Philip M. Henault +3 more | 2019-04-30 |
| 8471577 | Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrate | Daniel Stillman, James L. Oborny, William John Antheunisse, Ramyanshu Datta, Margaret Simmons-Matthews +1 more | 2013-06-25 |
| 8344749 | Through carrier dual side loop-back testing of TSV die after die attach to substrate | Daniel Stillman, James L. Oborny, William John Antheunisse, Ramyanshu Datta, Kenneth M. Butler +1 more | 2013-01-01 |
| 6878305 | Attaching components to a printed circuit card | George Hsieh, Terrance Dishongh, David V. Spaulding | 2005-04-12 |
| 6875367 | Attaching components to a printed circuit card | George Hsieh, Terrance Dishongh, David V. Spaulding | 2005-04-05 |
| 6818155 | Attaching components to a printed circuit card | George Hsieh, Terrance Dishongh, David V. Spaulding | 2004-11-16 |
| 5828226 | Probe card assembly for high density integrated circuits | H. Dan Higgins, Rajiv Pandey, R. Dennis Bates | 1998-10-27 |