Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142749 | Heat activated multiphase fluid-operated pump for motor temperature control | — | 2024-11-12 |
| 12133363 | Heat-activated pump with integrated evaporator for electronic chip heat removal | — | 2024-10-29 |
| 11990598 | Heat activated multiphase fluid-operated pump for battery temperature control | — | 2024-05-21 |
| 11898578 | Heat-activated multiphase fluid-operated pump | — | 2024-02-13 |
| 11874022 | Heat-activated multiphase fluid-operated pump for geothermal temperature control of structures | — | 2024-01-16 |
| 11737240 | Heat-activated multiphase fluid-operated pump for electronics waste heat removal | — | 2023-08-22 |
| 10468318 | Stiffener for providing uniformity in microelectronic packages | Weidong Xie, Qiang Wang, Yaoyu Pang | 2019-11-05 |
| 10260782 | Heat dissipation in hermetically-sealed packaged devices | Jovica Savic, Thomas Brenner | 2019-04-16 |
| 10230212 | Method and apparatus to prevent laser kink failures | Weidong Xie, Yaoyu Pang, Chiyu Liu, Qiang Wang | 2019-03-12 |
| 10186839 | Laser with pre-distorted grating | Chiyu Liu, Weidong Xie, Qiang Wang | 2019-01-22 |
| 9688453 | Heat dissipation in hermetically-sealed packaged devices | Jovica Savic, Thomas Brenner | 2017-06-27 |
| 9204548 | Electronic devices mounted on multiple substrates | Percy R. Aria | 2015-12-01 |
| 9086267 | Real time strain sensing solution | Weidong Xie, Qiang Wang | 2015-07-21 |
| 8962388 | Method and apparatus for supporting a computer chip on a printed circuit board assembly | Mohan R. Nagar, Kuo-Chuan Liu, Bangalore J. Shanker, Jie Xue | 2015-02-24 |
| 8952523 | Integrated circuit package lid configured for package coplanarity | Mohan R. Nagar, Weidong Xie | 2015-02-10 |
| 8736044 | Lid for an electrical hardware component | Kuo-Chuan Liu, Mohan R. Nagar, Bangalore J. Shanker | 2014-05-27 |
| 8081484 | Method and apparatus for supporting a computer chip on a printed circuit board assembly | Mohan R. Nagar, Kuo-Chuan Liu, Bangalore J. Shanker, Jie Xue | 2011-12-20 |
| 7797663 | Conductive dome probes for measuring system level multi-GHZ signals | Steven C. Bird, Varoujan Malian, Charles H. Casale, Danlu Tang | 2010-09-14 |
| 7621190 | Method and apparatus for strain monitoring of printed circuit board assemblies | Sue Yun Teng | 2009-11-24 |
| 7604491 | Techniques for providing electrical and thermal conductivity between electrical components and printed circuit boards using sleeves defining substantially conical shapes | David Popovich | 2009-10-20 |
| 7277297 | Device, apparatus, method and assembly for coupling an electrical component with a circuit board | Mason Hu, Robert Pattison, David Popovich | 2007-10-02 |
| 7019976 | Methods and apparatus for thermally coupling a heat sink to a circuit board component | Kenneth Hubbard | 2006-03-28 |
| 6728104 | Methods and apparatus for cooling a circuit board component | Susheela Narasimhan | 2004-04-27 |