Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7152315 | Method of making a printed circuit board | — | 2006-12-26 |
| 7111883 | Pivotable and interchangeable console | Udit Patel, Sunil Palakodati, Balaji Bharadwaj, Abha Tiwari | 2006-09-26 |
| 6998293 | Flip-chip bonding method | Achyuta Achari, Raja-Sheker Bollampally | 2006-02-14 |
| 6852932 | Circuit board with air-bridge | Achyuta Achari, Andrew Z. Glovatsky, Robert Edward Belke, Brenda Joyce Nation, Delin Li +3 more | 2005-02-08 |
| 6838623 | Electrical circuit board and a method for making the same | Lawrence Kneisel, Vivek Jairazboy, Vladimir Stoica | 2005-01-04 |
| 6826829 | Method for attaching a die with a low melting metal | Cuong Pham, Jay DeAvis Baker, Prathap Amervai Reddy, Vivek Amir Jairazbhoy | 2004-12-07 |
| 6739041 | Circuit board and a method for making the same | Bharat Patel, Jay DeAvis Baker | 2004-05-25 |
| 6729023 | Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material | Achyuta Achari, Andrew Z. Glovatsky, Robert Edward Belke, Brenda Joyce Nation, Delin Li +3 more | 2004-05-04 |
| 6673723 | Circuit board and a method for making the same | Bharat Patel, Jay DeAvis Baker, Lakhi Nandlal Goenka, Michael Howey, Richard Keith McMillan | 2004-01-06 |
| 6658731 | Method for fabricating connectors for interconnecting etched tri-metal circuit structures | Lakhi Nandlal Goenka, Thomas Krautheim | 2003-12-09 |
| 6623651 | Circuit board and a method for making the same | Bharat Patel, Jay DeAvis Baker | 2003-09-23 |
| 6620545 | ETM based battery | Lakhi Nandlal Goenka, William F. Quilty, Jr. | 2003-09-16 |
| 6613239 | Method for making an electrical circuit board | Andrew Z. Glovatsky, Robert Edward Belke, Delin Li, Lakhi Nandlal Goenka, Marc Straub +5 more | 2003-09-02 |
| 6611429 | Electronic circuit to MG beam grounding method | Daniel Lewis Kline, Hong Zhou, Karen Lee Chiles, Lawrence Kneisel, Puqiang Zhang | 2003-08-26 |
| 6601753 | Void-free die attachment method with low melting metal | Jay DeAvis Baker, Lawrence Kneisel, Prathap Amervai Reddy, Vivek Amir Jairazbhoy | 2003-08-05 |
| 6601296 | Multi-shot injection molding process for making electrical connectors and three-dimensional circuits | Daniel Phillip Dailey, Prathap Amerwai Reddy | 2003-08-05 |
| 6495053 | Electrical circuit board and a method for making the same | Lawrence Kneisel, Vivek Amir Jalrazbhoy, Vladimir Stoica | 2002-12-17 |
| 6475703 | Method for constructing multilayer circuit boards having air bridges | Delin Li, Achyuta Achari, Alice Dawn Zitzmann, Robert Edward Belke, Brenda Joyce Nation +2 more | 2002-11-05 |
| 6459041 | Etched tri-layer metal bonding layer | Achyuta Achari, Lakhi Nandlal Goenka | 2002-10-01 |
| 6454878 | Cladded material construction for etched-tri-metal circuits | Achyuta Achari, Brenda Joyce Nation, Jay DeAvis Baker, Lakhi Nandlal Goenka, Vladimir Stoica | 2002-09-24 |
| 6395994 | Etched tri-metal with integrated wire traces for wire bonding | Lakhi N. Goenka | 2002-05-28 |
| 6381837 | Method for making an electronic circuit assembly | Jay DeAvis Baker, Edward McLeskey, Delin Li, Cuong Pham, Robert Edward Belke +4 more | 2002-05-07 |
| 6376780 | Method for strengthening air bridge circuits | Lakhi Nandlal Goenka | 2002-04-23 |
| 6360939 | Lead-free electrical solder and method of manufacturing | Dongkai Shangguan | 2002-03-26 |
| 6274407 | Method and article for attaching high-operating-temperature electronic component | Jay DeAvis Baker, Prathap Amerwai Reddy, Vivek Amir Jairazbhoy | 2001-08-14 |