Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6747361 | Semiconductor device and packaging method thereof | — | 2004-06-08 |
| 6611063 | Resin-encapsulated semiconductor device | Tomoko Takizawa, Hirokazu Honda, Keiichirou Kata | 2003-08-26 |
| 6538305 | BGA type semiconductor device having a solder-flow damping/stopping pattern | — | 2003-03-25 |
| 6504244 | Semiconductor device and semiconductor module using the same | Tomoko Takizawa | 2003-01-07 |
| 6265760 | Semiconductor device, and semiconductor device with die pad and protruding chip lead frame and method of manufacturing the same | Takehito Inaba, Kenji Oyachi | 2001-07-24 |
| 6259152 | Hybrid leadframe having conductive leads less deformable and semiconductor device using the same | Hiromitsu Takeda, Takehito Inaba, Ken Fukamachi | 2001-07-10 |
| 6246117 | Semiconductor device comprised of a ball grid array and an insulating film with preformed land openings | — | 2001-06-12 |
| 6215169 | Semiconductor device with adhesive tape not overlapping an opening in the uppermost surface of the semiconductor element surface | — | 2001-04-10 |
| 6211573 | Semiconductor device with an improved lead-chip adhesion structure and lead frame to be used therefor | — | 2001-04-03 |
| 6166443 | Semiconductor device with reduced thickness | Takehito Inaba, Kenji Oyachi | 2000-12-26 |