Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583455 | Semiconductor device | Tamaki Wada, Yuichi Morinaga | 2017-02-28 |
| 9337134 | Semiconductor device | Tamaki Wada, Yuichi Morinaga | 2016-05-10 |
| 6313540 | Electrode structure of semiconductor element | Tsuyoshi Kida | 2001-11-06 |
| 6265760 | Semiconductor device, and semiconductor device with die pad and protruding chip lead frame and method of manufacturing the same | Takehito Inaba, Michihiko Ichinose | 2001-07-24 |
| 6166443 | Semiconductor device with reduced thickness | Takehito Inaba, Michihiko Ichinose | 2000-12-26 |
| 5647527 | Method of determining order of wire-bonding | — | 1997-07-15 |