| 7253363 |
Circuit board |
Shota Iwasaki |
2007-08-07 |
| 6815619 |
Circuit board |
Shota Iwasaki |
2004-11-09 |
| 6265760 |
Semiconductor device, and semiconductor device with die pad and protruding chip lead frame and method of manufacturing the same |
Michihiko Ichinose, Kenji Oyachi |
2001-07-24 |
| 6259152 |
Hybrid leadframe having conductive leads less deformable and semiconductor device using the same |
Hiromitsu Takeda, Michihiko Ichinose, Ken Fukamachi |
2001-07-10 |
| 6255742 |
Semiconductor package incorporating heat dispersion plate inside resin molding |
— |
2001-07-03 |
| 6166443 |
Semiconductor device with reduced thickness |
Michihiko Ichinose, Kenji Oyachi |
2000-12-26 |
| 6093958 |
Lead-on-chip type semiconductor device having thin plate and method for manufacturing the same |
— |
2000-07-25 |
| 6054753 |
Plastic-encapsulated semiconductor device equipped with LOC package structure |
— |
2000-04-25 |
| 5757067 |
Resin-sealed type semiconductor device |
— |
1998-05-26 |
| 5635220 |
Molding die for sealing semiconductor device with reduced resin burrs |
Atsuhiko Izumi, Kousuke Azuma |
1997-06-03 |