Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5766649 | Resin sealing mold die set with less resin remainder for semiconductor device | — | 1998-06-16 |
| 5635220 | Molding die for sealing semiconductor device with reduced resin burrs | Atsuhiko Izumi, Takehito Inaba | 1997-06-03 |