Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8598029 | Method for fabricating flip-attached and underfilled semiconductor devices | Masazumi Amagai | 2013-12-03 |
| 8193085 | Method for fabricating flip-attached and underfilled semiconductor devices | Masazumi Amagai | 2012-06-05 |
| 7701071 | Method for fabricating flip-attached and underfilled semiconductor devices | Masazumi Amagai | 2010-04-20 |
| 7646193 | Device inspection device, device inspection system using the same, and mobile telephone holding device | Yoshio Suzuki | 2010-01-12 |
| 7282175 | Lead-free solder | Masazumi Amagai, Kensho Murata, Yoshitaka Toyoda, Minoru Ueshima, Tsukasa Ohnishi +4 more | 2007-10-16 |
| 7029542 | Lead-free solder alloy | Masazumi Amagai, Kensho Murata, Osamu Munekata, Yoshitaka Toyoda, Minoru Ueshima +2 more | 2006-04-18 |
| 6887778 | Semiconductor device and manufacturing method | Mutsumi Masumoto | 2005-05-03 |
| 6762506 | Assembly of semiconductor device and wiring substrate | Masazumi Amagai | 2004-07-13 |