| 6589815 |
Method of manufacturing semiconductor device with plated heat sink by laser cutting |
Hiroshi Matsuoka, Kazuo Hayashi |
2003-07-08 |
| 6537057 |
Mold clamping apparatus for injection molding machine |
Jun Koike |
2003-03-25 |
| 6533573 |
Mold clamping apparatus for injection molding machine |
Jun Koike |
2003-03-18 |
| 6500325 |
Method of plating semiconductor wafer and plated semiconductor wafer |
Katsuya Kosaki |
2002-12-31 |
| 6391770 |
Method of manufacturing semiconductor device |
Katsuya Kosaki, Takao Ishida |
2002-05-21 |
| 6332355 |
Method of estimating a life of ball screw included in electric injection molding machine and life estimating system |
Tsuginobu Totani, Kiyoshi Sasaki, Akira Kanda, Yukio Iimura, Jun Koike +2 more |
2001-12-25 |
| 6329671 |
Semiconductor device and method of manufacturing the same |
Kazuo Hayashi, Shozui Takeno |
2001-12-11 |
| 6325954 |
Method of controlling electric injection unit of injection molding machine |
Kiyoshi Sasaki, Fumiyuki Kato, Tsuginobu Totani, Fukio Iimura, Jun Koike +1 more |
2001-12-04 |
| 6309203 |
Injection apparatus for injection molding machine |
Jun Koike |
2001-10-30 |
| 6270333 |
Mold clamping apparatus for injection molding machine |
Jun Koike |
2001-08-07 |
| 6268619 |
Semiconductor device with high aspect ratio via hole including solder repelling coating |
Katsuya Kosaki, Takao Ishida |
2001-07-31 |
| 6245596 |
Method of producing semiconductor device with heat dissipation metal layer and metal projections |
Katsuya Kosaki, Hiroshi Matsuoka |
2001-06-12 |
| 6210554 |
Method of plating semiconductor wafer and plated semiconductor wafer |
Katsuya Kosaki |
2001-04-03 |
| 6157077 |
Semiconductor device with plated heat sink and partially plated side surfaces |
Hiroshi Matsuoka, Kazuo Hayashi |
2000-12-05 |
| 6144182 |
Motor control method for injection molding machine and motor controller for carrying out the same |
Tsuginobu Totani, Fumiyuki Katoh, Kiyoshi Sasaki, Yukio Iimura, Jun Koike +1 more |
2000-11-07 |
| 6136668 |
Method of dicing semiconductor wafer |
Kazuo Hayashi, Shozui Takeno |
2000-10-24 |
| 6132198 |
Clamping apparatus for injection molding machine |
Jun Koike |
2000-10-17 |
| 6109036 |
Sealed hydraulic intensifier |
Jun Koike |
2000-08-29 |
| 6059556 |
Injection apparatus for injection molding machine |
Jun Koike |
2000-05-09 |
| 6050804 |
Clamping apparatus for injection molding machine |
Jun Koike |
2000-04-18 |
| 6033540 |
Plating apparatus for plating a wafer |
Katsuya Kosaki |
2000-03-07 |
| 6008537 |
Semiconductor device with heat dissipation metal layer and metal projections |
Katsuya Kosaki, Hiroshi Matsuoka |
1999-12-28 |
| 5853559 |
Apparatus for electroplating a semiconductor substrate |
Katsuya Kosaki |
1998-12-29 |
| 5457072 |
Process for dicing a semiconductor wafer having a plated heat sink using a temporary substrate |
Kouji Aono, Sinichi Sakamoto |
1995-10-10 |
