Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7442634 | Method for constructing contact formations | Valery M. Dubin, Tzuen-Luh Huang, Ming Fang, Kevin J. Lee, Yuehai Liang | 2008-10-28 |
| 7064446 | Under bump metallization layer to enable use of high tin content solder bumps | John Barnak, Gerald Feldewerth, Ming Fang, Kevin J. Lee, Tzuen-Luh Huang +3 more | 2006-06-20 |