Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9452511 | Combination ER wrench | — | 2016-09-27 |
| 9109188 | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate | William A. Wojtczak, Ma. Fatima Seijo, David Bernhard | 2015-08-18 |
| 8293694 | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate | William A. Wojtczak, Ma. Fatimo Seijo, David Bernhard | 2012-10-23 |
| 7662762 | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates | William A. Wojtczak, Ma. Fatima Seijo, David Bernhard | 2010-02-16 |
| 7605113 | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate | William A. Wojtczak, Ma. Fatima Seijo, David Bernhard | 2009-10-20 |
| 7427567 | Polishing slurries for copper and associated materials | Willaim A. Wojtczak, Thomas H. Baum, Cary Regulski | 2008-09-23 |
| 6967169 | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate | William A. Wojtczak, Ma. Fatima Seijo, David Bernhard | 2005-11-22 |
| 6936542 | Polishing slurries for copper and associated materials | William A. Wojtczak, Thomas H. Baum, Cary Regulski | 2005-08-30 |
| 6896826 | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate | William A. Wojtczak, Ma. Fatima Seijo, David Bernhard | 2005-05-24 |
| 6755989 | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate | William A. Wojtczak, Ma. Fatima Seijo, David Bernhard | 2004-06-29 |
| 6660700 | Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures | William A. Wojtczak, Ma. Fatima Seijo, David Bernhard | 2003-12-09 |
| 6599870 | Boric acid containing compositions for stripping residues from semiconductor substrates | William A. Wojtczak, George Guan | 2003-07-29 |
| 6566315 | Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures | William A. Wojtczak, Ma. Fatima Seijo, Dave Bernhard | 2003-05-20 |
| 6527819 | Polishing slurries for copper and associated materials | William A. Wojtczak, Thomas H. Baum, Cary Regulski | 2003-03-04 |
| 6492310 | Boric acid containing compositions for stripping residues from semiconductor substrates | William A. Wojtczak, George Guan | 2002-12-10 |
| 6409781 | Polishing slurries for copper and associated materials | William A. Wojtczak, Thomas H. Baum, Cary Regulski | 2002-06-25 |
| 6383410 | Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent | William A. Wojtczak, Stephen A. Fine | 2002-05-07 |
| 6344432 | Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures | William A. Wojtczak, Ma. Fatima Seijo, David Bernhard | 2002-02-05 |
| 6306807 | Boric acid containing compositions for stripping residues from semiconductor substrates | William A. Wojtczak, George Guan | 2001-10-23 |
| 6280651 | Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent | William A. Wojtczak, Stephen A. Fine | 2001-08-28 |