Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7968991 | Stacked package module and board having exposed ends | Mao-Hua Yeh, Wang-Hsiang Tsai | 2011-06-28 |
| 7880296 | Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereon | Zao-Kuo Lai | 2011-02-01 |
| 7656015 | Packaging substrate having heat-dissipating structure | Mao-Hua Yeh | 2010-02-02 |
| 7507915 | Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same | Chia-Wei Chang, Zao-Kuo Lai, Chung-Cheng Lien | 2009-03-24 |
| 7396753 | Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same | Chih-Liang Chu, E-Tung Chou | 2008-07-08 |
| 7323762 | Semiconductor package substrate with embedded resistors and method for fabricating the same | Zao-Kuo Lai | 2008-01-29 |
| 7135377 | Semiconductor package substrate with embedded resistors and method for fabricating same | Zao-Kuo Lai | 2006-11-14 |
| 7050304 | Heat sink structure with embedded electronic components for semiconductor package | Shih-Ping Hsu | 2006-05-23 |